Applied Materials, Inc. has announced that it is leading a major effort to enable the widespread adoption of through-silicon vias (TSVs), a rapidly-emerging approach for vertically stacking integrated circuits (ICs) to boost chip performance and functionality in a smaller area. TSVs will be critical to satisfying consumers’ demands for faster, smaller electronics, enabling applications such as DDR4 DRAM memories and future communications and mobile internet chips. Since the biggest roadblock ...